FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics-Reference-Cited by-同舟云学术

FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics

Published:2020-08 Issue: Volume:111 Page:113683
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Grams Arian,Jaeschke Johannes,Wittler Olaf,Fabian Benjamin,Thomas Sven,Schneider-Ramelow Martin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. The future of wire bonding is? Wire bonding!;Siepe,2010

2. A new aluminium alloy for heavy wire bonding in power electronics - first tests of bonding behaviour and reliability;Geißler,2013

3. Reliability assessment of sintered nano-silver die attachment for power semiconductors;Knoerr,2010

4. Microstructural and mechanical analyses of Ag sintered joints;Weber,2014

5. Model for power cycling lifetime of IGBT modules – various factors influencing lifetime;Bayerer,2008

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