Author:
Mei J.,Haug R.,Grözinger T.,Zimmermann A.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling;Che;IEEE Trans. Device Mater. Reliab.,2013
2. A. Syed, “Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints,” 54th ECTC, 2004, pp. 737–746.
3. Board level solder reliability versus ramp rate and dwell time during temperature cycling;Zhai;IEEE Trans. Device Mater. Reliab.,2003
4. Y. W. Chang, Y. Cheng, L. Helfen et al., “Electromigration mechanism of failure in flip-chip solder joints based on discrete voids formation,” Sci. Rep., vol. 7, no. 1, pp. 17950, Dec. 2017.
5. A statistical mechanics model to predict electromigration induced damage and void growth in solder interconnects;Wang;Phys. A Stat. Mech. Appl.,2017
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