Author:
Frewein M.,Krivec T.,Tao Q.,Zuendel J.,Rosc J.,Gschwandl M.,Fuchs Peter F.
Cited by
6 articles.
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1. Investigation of the effects of moisture expansion of glass fiber reinforced epoxy resins on printed circuit boards using digital image correlation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Material Characterization and Modelling for FE-Based Reliability Assessment of PCBs and Electronic Systems;Recent Advances in Microelectronics Reliability;2024
4. Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25