A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies-Reference-Cited by-同舟云学术

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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Published:2024-04-07 Issue: Volume: Page:1-7
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Kamble Vikram G¹,Patel Dhaval Rasheshkumar¹,Schipfer Christian¹,Thalhamer Andreas¹,Zuendel Julia²,Krivec Thomas²,Antretter Thomas³,Fuchs Peter Filipp¹

Affiliation:

1. Polymer Competence Center Leoben GmbH,Sauraugasse 1, 8700 Leoben,Austria

2. Austria Technologie & Systemtechnik Aktiengesellschaft,Fabriksgasse 13, 8700 Leoben,Austria

3. Institute of Mechanics,Montanuniversität Leoben,Franz-Josef-Strasse 18, 8700 Leoben,Austria

Funder

Engineering and Physical Sciences Research Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491487.pdf?arnumber=10491487

Reference32 articles.

1. Analysis of microvia interconnects

2. Printed Circuits Handbook;Coombs,2016

3. Laser Drilling of Metallic and Nonmetallic Materials and Quality Assessment

4. Reliability testing for microvias in printed wire boards

5. Two-Side Laser Processing Method for Producing High Aspect Ratio Microholes

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