Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach-Reference-Cited by-同舟云学术

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Published:2023-04-17 Issue: Volume: Page:
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Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Weninger M.¹,Zündel J.¹,Krivec T.¹,Frewein M.¹,Waschnig S.¹,Fuchs P.²,Obst C.³

Affiliation:

1. AT&S Austria Technologie & Systemtechnik Aktiengesellschaft,Austria

2. Polymer Competence Center Leoben GmbH,Austria

3. Prime Aerostructures GmbH,Austria

Publisher

IEEE

Link

Reference9 articles.

1. Comparison of finite elements based thermal shock test reliability assessment with a specimen based test approach;tao;IPC APEX 2018,2018

2. FEM zur Berechnung von Kunststoff-und Elastomerbauteilen;stommel;Carl Hanser Verlag GmbH Co KG,2018

4. Application and Analysis of Parametric Substructure’s New Modeling Method in PCB Components;li;Applied Mechanics and Materials,2014

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