Life-time prediction of copper µ-vias based on a stochastic design variation approach-Reference-Cited by-同舟云学术

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Life-time prediction of copper µ-vias based on a stochastic design variation approach

Published:2024-04-07 Issue: Volume: Page:1-7
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Zündel Julia¹,Krivec Thomas¹,Weninger Markus¹

Affiliation:

1. AT&S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse 13,Leoben,Austria

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491532.pdf?arnumber=10491532

Reference8 articles.

1. A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards

2. Fatigue and durability of structural materials

3. Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

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