Investigation of the effects of moisture expansion of glass fiber reinforced epoxy resins on printed circuit boards using digital image correlation
Author:
Affiliation:
1. AT&S – Austria Technologie & Systemtechnik Aktiengesellschaft Leoben, Austria Fabriksgasse 13,Leoben,Austria,8700
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491537.pdf?arnumber=10491537
Reference11 articles.
1. An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage
2. High speed cameras for motion analysis in sports science
3. Package Level Warpage Simulation of a Fan Out System in Board Module
4. Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
5. Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials
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