An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage-Reference-Cited by-同舟云学术

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Published:2022-04-25 Issue: Volume: Page:
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Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Frewein M.¹,Stojanovic S.¹,Tao Q.¹,Krivec T.¹,Zuendel J.¹,Goessler M.¹,Fuchs P. F.²,Gschwandl M.²

Affiliation:

1. AT&S - Austria Technologie & Systemtechnik Aktiengesellschaft,Leoben,Austria

2. Polymer Competence Center Leoben GmbH,Austria

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758866.pdf?arnumber=9758866

Reference24 articles.

1. Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

2. Various Experimental Applications of Digital Image Correlation Method;mguil-touchal;Computational Methods and Experimental Measurements XI,1997

3. Systematic mechanical characterization and micromechanical modelling of woven glass fibre reinforced laminates for PCB applications;frewein;Master thesis,2018

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