Author:
Vinciguerra Vincenzo,Landi Antonio
Cited by
10 articles.
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1. Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. A Comparison of Analytical and Finite Element Analysis Methods for Determining the Equivalent Thickness of Large 4H-SiC Taiko Wafers;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Extension of the Equivalent Thickness Concept to the Bifurcation of Large Semiconductor Front Side Metal Taiko Wafer investigated by ANSYS Finite Element Analysis Methods;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
4. Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis;Applied Sciences;2023-07-24
5. Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell Elements;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17