A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules

Published:2023-11-13 Issue: Volume: Page:1-3
ISSN:
Container-title:2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
language:
Short-container-title:

Author:

Yu Huaiqiang¹,Peng Jiahong¹,Wang Xi¹,Tan Yuting¹,Wen Peng¹,Tao Yi¹,Deng Like¹,Jiang Chuangxin¹

Affiliation:

1. Sichuan Institute of Piezoelectric and Acousto-optic Technology,Chongqing,China,400060

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10380804/10380975/10381227.pdf?arnumber=10381227

Reference6 articles.

1. Implementation of a Highly Integrated Triple-Band RF Front-End Module

2. A wide-band RF Front-end module for 5G mMIMO applications

3. A fully integrated flip-chip SiGe BiCMOS power amplifier for 802.11ac applications

4. FBAR Rx filters for handset front-end modules with wafer-level packaging

5. Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP