Author:
Kim Dongsu,Ryu Jong In,Cho Hyun-Min,Kang Nam-Kee,Kim Jun Chul
Cited by
5 articles.
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1. A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
2. Pixelated RF: Random Metasurface Based Electromagnetic Filters;2023 21st IEEE Interregional NEWCAS Conference (NEWCAS);2023-06-26
3. Compact Triplexer Using L-type Matching Networks;Transactions of The Japan Institute of Electronics Packaging;2022
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