Author:
Fraser Mike,Malladi Venkata N.K,Staudinger Joseph,Chang Chun-Wei
Cited by
2 articles.
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1. A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
2. High-Voltage Analog Switch Inspired by Stacked MOSFET-Based RF Switches;IEEE Transactions on Circuits and Systems II: Express Briefs;2023-11