Author:
Kun Wang ,Frank M.,Bradley P.,Ruby R.,Mueller W.,Barfknecht A.,Gat M.
Cited by
2 articles.
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1. A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
2. Tuning the Resonant Frequency of Resonators Using Molecular Surface Self-assembly Approach;ACS Applied Materials & Interfaces;2014-12-22