A Novel Process to Reduce the Warpage of Bond Pair for Temporary Bonding and De-bonding Technique
Author:
Affiliation:
1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen,China,518055
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873167.pdf?arnumber=9873167
Reference7 articles.
1. Temporary Bonding Using Paper Inserted PPC Layer[J];zhiyuan zhu;Inf Midem-J Microelectron Electron Components Mater,2019
2. A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly
3. Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process
4. Finite-Element Simulation of Different Kinds of Wafer Warpages: Spherical, Cylindrical, and Saddle
5. Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Thermal Resistant Temporary Bonding Material for Fan-out Wafer Level Packaging: Dual-curing and Dual-debonding Strategies are Available;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Via-Last TSV (From Top) Fabrication on a LNA SOI Wafer for 3D Heterogeneous Chiplet Integration;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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