Funder
Ministry of Science and Technology, Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
24 articles.
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1. Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
2. Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin;Microelectronics Reliability;2024-06
3. Transitioning from Warpage "Control" to Warpage "Design": A Paradigm Shift;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
5. Development of high performance 2.5D packaging using glass interposer with through glass vias;Journal of Materials Science: Materials in Electronics;2023-09