Author:
Hao Chang,Yong Xu,Tianming Ni
Funder
National Natural Science Foundation of China
Cited by
5 articles.
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1. A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method;IEEE Transactions on Instrumentation and Measurement;2024
2. TSPC Trigger-Based Testing Scheme for Pre-Bond Testing and Diagnosis of TSVs;2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT);2023-12-29
3. Modelling and analysis of contactless sensor for TSV fault based on resonant inductive coupling;Microelectronics Reliability;2023-06
4. Kelvin Bridge Structure Based TSV Test for Weak Faults;2021 IEEE International Test Conference in Asia (ITC-Asia);2021-08-18
5. Fault Coexistence and Grading Aware TSV Test based on Delay Feature;International Journal of Circuits, Systems and Signal Processing;2021-07-19