A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method-Reference-Cited by-同舟云学术

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A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method

Published:2024 Issue: Volume:73 Page:1-10
ISSN:0018-9456
Container-title:IEEE Transactions on Instrumentation and Measurement
language:
Short-container-title:IEEE Trans. Instrum. Meas.

Author:

Liu Jun¹^ORCID,Chen Zhi¹^ORCID,Cheng Songren¹^ORCID,Xiang Chen¹^ORCID,Chen Tian¹^ORCID,Wu Xi¹^ORCID,Lu Yingchun²^ORCID,Liang Huaguo²^ORCID

Affiliation:

1. Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent Machine, School of Computer and Information, and the Intelligent Interconnected Systems Laboratory of Anhui Province, Hefei University of Technology, Hefei, China

2. School of Microelectronics, Hefei University of Technology, Hefei, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/19/10367905/10597647.pdf?arnumber=10597647

Reference25 articles.

1. The 3-D Interconnect Technology Landscape

2. Security and Vulnerability Implications of 3D ICs

3. Overview of 3-D Architecture Design Opportunities and Techniques

4. Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC

5. A Comparative Study of Pre-bond TSV Test Methodologies

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