IEEE Standard 1500 Compatible Interconnect Diagnosis for Delay and Crosstalk Faults

Author:

Li K.S.-M.,Su C.,Chang Y.-W.,Lee C.-L.,Chen J.E.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Testing of Weak Open Defects in Interconnects Using Boundary Scan;Journal of The Japan Institute of Electronics Packaging;2024-07-01

2. Current Research Topics on Boundary-Scan Technology;Journal of The Japan Institute of Electronics Packaging;2020-09-01

3. An Enhanced Boundary Scan Architecture for Inter-Die Interconnect Leakage Measurement in 2.5D and 3D Packages;2017 IEEE 26th Asian Test Symposium (ATS);2017-11

4. IEEE 1500 Compatible Multilevel Maximal Concurrent Interconnect Test;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2013-07

5. A fully parallel BIST-based method to test the crosstalk defects on the inter-switch links in NOC;Microelectronics Journal;2013-03

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