Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect-Reference-Cited by-同舟云学术

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Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect

Published: Issue: Volume: Page:
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Container-title:Proceedings Electronic Components and Technology, 2005. ECTC '05.
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Author:

McMahon J.J.,Lu J.-Q.,Gutmann R.J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9844/31024/01441287.pdf?arnumber=1441287

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging;The Journal of Physical Chemistry Letters;2022-08-24

2. Polymer Direct Bonding Characterization in Wafer Level Packaging for 3D Integration;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21

3. Effect of Annealing-Induced Tensions on the Mechanical Failure of Copper/Copper Interface in Wafer-to-Wafer Hybrid Bonding;ECS Journal of Solid State Science and Technology;2021-02-01

4. Wafer-Level Three-Dimensional Integration for Advanced CMOS Systems;Circuits at the Nanoscale;2008-09-09

5. Direct Hybrid Bonding;Integrated Circuits and Systems;2008

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