Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging-Reference-Cited by-同舟云学术

Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging

Published:2022-08-24 Issue:34 Volume:13 Page:8130-8133
ISSN:1948-7185
Container-title:The Journal of Physical Chemistry Letters
language:en
Short-container-title:J. Phys. Chem. Lett.

Author:

Brady-Boyd Anita¹^ORCID,Chery Emmanuel¹^ORCID,Armini Silvia¹

Affiliation:

1. imec, 3001 Leuven, Belgium

Funder

H2020 Marie Sklodowska-Curie Actions

Publisher

American Chemical Society (ACS)

Subject

General Materials Science,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpclett.2c02080

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5. Overview and outlook of through‐silicon via (TSV) and 3D integrations

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