Direct Hybrid Bonding-Reference-Cited by-同舟云学术

Direct Hybrid Bonding

Published:2008 Issue: Volume: Page:1-11
ISSN:1558-9412
Container-title:Integrated Circuits and Systems
language:
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Author:

Swinnen Bart,Jourdain Anne,De Moor Piet,Beyne Eric

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-0-387-76534-1_11

Reference8 articles.

1. Beyne E (2001) Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits. In: International Electron Devices Meeting Technical Digest, IEEE, pp 371–374

2. Beyne E (2004) 3D Interconnection and packaging: impending reality or still a dream. In: Proceedings of the 2004 IEEE International Solid State Circuit Conference, IEEE, pp 138–145

3. McMahon JJ, Lu JQ, Gutmann RJ (2005) Wafer bonding of Damascene-Patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect. In: Proceeding of the 55th Electronic Components and Technology conference, IEEE, pp 331–336

4. Jourdain A, Stoukatch S, De Moor P, Ruythooren W, Pargfrieder S, Swinnen B, Beyne E (2007) Simultaneous Cu–Cu and compliant dielectric bonding for 3D stacking of ICs. In: Proceedings of the International Interconnect Technology Conference, IEEE, pp 207–209

5. Beyne E (2006) The rise of the 3rd dimension for system integration. In: Proceedings of the International Interconnect Technology Conference, IEEE, pp 1–5

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