Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications-Reference-Cited by-同舟云学术

Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

Published:2023-02 Issue:2 Volume:13 Page:219-229
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Jia Xiaofan¹^ORCID,Li Xingchen¹^ORCID,Erdogan Serhat¹^ORCID,Moon Kyoung-Sik²,Kim Joon Woo¹,Huang Kai-Qi¹^ORCID,Jordan Matthew B.³,Swaminathan Madhavan⁴^ORCID

Affiliation:

1. 3D Systems Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. 3D Systems Packaging Research Center, School of Materials Science, Georgia Institute of Technology, Atlanta, GA, USA

3. Sandia National Laboratories, Albuquerque, NM, USA

4. School of Electrical Engineering and Computer Science, Pennsylvania State University, University Park, PA, USA

Funder

ASCENT and ComSenTer, two of six centers in JUMP, a Semiconductor Research Corporation

Industry Consortium at the Georgia Tech 3D Systems Packaging Research Center

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10082754/10057443.pdf?arnumber=10057443

Reference36 articles.

1. Advanced Flip Chip Packaging

2. A -Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production

3. Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

4. Integrated and Miniaturized Quasi Yagi D-Band Antenna in Glass Interposer

5. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

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