Author:
Zhang Bing,Karnfelt Camilla,Gulan Heiko,Zwick Thomas,Zirath Herbert
Funder
Swedish Foundation for Strategic Research through the Program RFIC solutions for very high data rate, energy and spectrum efficient wireless THz communication
Swedish Research Council through the Program Gigabits at THz frequencies
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
23 articles.
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2. A Low-Cost Antenna-in-Package (AiP) for D-Band Application;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02
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