Antenna Array on Glass Interposer for 6G Wireless Communications-Reference-Cited by-同舟云学术

Antenna Array on Glass Interposer for 6G Wireless Communications

Published:2023-02 Issue:2 Volume:13 Page:211-218
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Huang Kai-Qi¹^ORCID,Swaminathan Madhavan²^ORCID

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. School of Electrical and Computer Engineering and the School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Funder

ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA

Georgia Tech Packaging Research Center (GT–PRC) Industry Consortium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10082754/10040707.pdf?arnumber=10040707

Reference21 articles.

1. 2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages

2. Die-embedded glass packaging for 6G wireless applications;jia;MRS Adv,2022

3. Antennas in Glass Interposer For sub-THz Applications

4. Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density

5. Introduction to microwave systems;pozar;Microwave Engineering,2011

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