Die-embedded glass packaging for 6G wireless applications

Author:

Jia Xiaofan,Li Xingchen,Moon Kyoung-Sik,Swaminathan Madhavan

Funder

Semiconductor Research Corporation

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

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2. A. Simsek, S.-K. Kim, M. Abdelghany, A.S. Ahmed, A.A. Farid, U. Madhow, M.J. Rodwell, A 146.7 GHz transceiver with 5 GBaud data transmission using a low-cost series-fed patch antenna array through wirebonding integration, in 2020 IEEE Radio and Wireless Symposium (RWS), 2020, pp. 68–71. https://doi.org/10.1109/RWS45077.2020.9049978

3. A. Singh, M. Sayginer, M.J. Holyoak, J. Weiner, J. Kimionis, M. Elkhouly, Y. Baeyens, S. Shahramian, A D-band radio-on-glass module for spectrally-efficient and low-cost wireless backhaul, in 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2020, pp. 99–102. https://doi.org/10.1109/RFIC49505.2020.9218437

4. S. Ravichandran, M. Kathaperumal, M. Swaminathan, R. Tummala, Large-body-sized glass-based active interposer for high-performance computing, in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 879–884. https://doi.org/10.1109/ECTC32862.2020.00144

5. A.O. Watanabe, M. Ali, R. Zhang, S. Ravichandran, T. Kakutani, P.M. Raj, R.R. Tummala, M. Swaminathan, Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications, in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 89–94. https://doi.org/10.1109/ECTC32862.2020.00027

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1. Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer;ACS Applied Engineering Materials;2024-02-19

2. Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

3. Antenna Array on Glass Interposer for 6G Wireless Communications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

4. Research snapshots from the 40th year of the Semiconductor Research Corporation;MRS Advances;2022-11-11

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