Large-body-sized Glass-based Active Interposer for High-Performance Computing
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159435.pdf?arnumber=9159435
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-11
2. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach;Micromachines;2023-07-27
3. Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
4. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04
5. Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02
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