Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications-Reference-Cited by-同舟云学术

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Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications

Published:2024-05-28 Issue: Volume: Page:732-737
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Le Thi Huyen¹,Kaiser Michael Philipp¹,Koezegi Julia-Marie¹,Murugesan Kavin Senthil¹,Gerhold Lutz¹,Hichri Habib²,Oishi Ryohei³,Nakano Reki³,Ndip Ivan⁴,Schneider-Ramelow Martin⁵

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

2. Ajinomoto Fine-Techno USA Corporation,California,USA

3. Ajinomoto Corporation Inc.,Tokyo,Japan

4. Brandenburg University of Technology Cottbus-Senftenberg (BTU),Fraunhofer Institute for Reliability and Microintegration Berlin,Germany

5. Technical University Berlin,Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565093.pdf?arnumber=10565093

Reference12 articles.

1. CMOS On-chip Dual L-shaped Slot Antennas

2. A d-band on-chip dielectric resonator antenna fed by half-mode cavity in CMOS technology

3. 140 GHz CMOS on-chip dipole antenna with optimal ion-irradiated-silicon with vertical reflector;Sato

4. A 122 GHz On-Chip 3-Element Patch Antenna Array with 10 GHz Bandwidth

5. A micromachined double-dipole antenna for 122 – 140 GHz applications based on a SiGe BiCMOS technology

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