A Broadband D-Band Cavity-Backed Coupled-Feed Patch Antenna in Wafer-Level Package Based on Heterogeneous Integrations-Reference-Cited by-同舟云学术

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A Broadband D-Band Cavity-Backed Coupled-Feed Patch Antenna in Wafer-Level Package Based on Heterogeneous Integrations

Published:2024-08 Issue:8 Volume:72 Page:6298-6308
ISSN:0018-926X
Container-title:IEEE Transactions on Antennas and Propagation
language:
Short-container-title:IEEE Trans. Antennas Propagat.

Author:

Wang Xiaocheng¹^ORCID,Xiao Gaobiao¹^ORCID,Zhao Binshan¹^ORCID,Huang Yinshan¹^ORCID,Xu Qihao¹^ORCID

Affiliation:

1. State Key Laboratory of Radio Frequency Heterogeneous Integration, Shanghai Jiao Tong University, Shanghai, China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/8/10633212/10593807.pdf?arnumber=10593807

Reference41 articles.

1. A Vision of 6G Wireless Systems: Applications, Trends, Technologies, and Open Research Problems

2. A -Band 48-Gbit/s 64-QAM/QPSK Direct-Conversion I/Q Transceiver Chipset

3. An Eight-Element 136–147 GHz Wafer-Scale Phased-Array Transmitter With 32 dBm Peak EIRP and >16 Gbps 16QAM and 64QAM Operation

4. A Highly Efficient 165-GHz 4FSK 17-Gb/s Transceiver System With Frequency Overlapping Architecture in 65-nm CMOS

5. An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

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