Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects-Reference-Cited by-同舟云学术

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Published:2011-09 Issue:9 Volume:1 Page:1336-1344
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yu Aibin,Lau John H.,Ho Soon Wee,Kumar Aditya,Hnin Wai Yin,Lee Wen Sheng,Jong Ming Ching,Sekhar Vasarla Nagendra,Kripesh Vaidyanathan,Pinjala Damaruganath,Chen Scott,Chan Chien-Feng,Chao Chun-Chieh,Chiu Chi-Hsin,Huang Chih-Ming,Chen Carl

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6019138/05957270.pdf?arnumber=5957270

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