Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads-Reference-Cited by-同舟云学术

Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads

Published:2023-01 Issue:1 Volume:13 Page:26-33
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Shuye¹^ORCID,Sun Mingjia¹,Yang Jianqun²,Li Xingji²^ORCID,He Peng¹,Paik Kyung-Wook³^ORCID

Affiliation:

1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China

2. Chongqing Research Institute, Harbin Institute of Technology, Chongqing, China

3. Nano-Packaging and Interconnection Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, South Korea

Funder

National Key Research and Development Program of China

Key Laboratory of Silicon Device Technology of Chinese Academy of Sciences

Chongqing Natural Science Foundation of China

Basic Research Funds for Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference25 articles.

4. Review of simulation approaches in reliability and availability modeling;naikan;Int J Performability Eng,2016

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