Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array-Reference-Cited by-同舟云学术

Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array

Published:2023-02 Issue:2 Volume:13 Page:161-170
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Li Wei¹^ORCID,Qian Wenbing¹,Zhao Xiaoliang¹,Liu Yuanyang¹^ORCID,Wang Zhenyu¹^ORCID,Wang Wei²^ORCID,Zhang Xiaobin³,Zhao Yongzhi⁴^ORCID

Affiliation:

1. School of Software and Microelectronics, Peking University, Beijing, China

2. School of Integrated Circuits, Peking University, Beijing, China

3. Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China

4. 13th Research Institute of CETC, Shijiazhuang, China

Funder

National Key Research and Development Program of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference46 articles.

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