A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks-Reference-Cited by-同舟云学术

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A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks

Published:2021-08 Issue: Volume:175 Page:121332
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Deng Daxiang,Zeng Long,Sun Wei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference229 articles.

1. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review;He;Energy,2020

2. Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits;Kandlikar;J Electron Packaging,2014

3. High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift;Herwig;J Heat Transfer,2013

4. Recent Advances in High-Flux, Two-Phase Thermal Management;Mudawar;ASME J Therm Sci Eng Appl,2013

5. Experimental investigation on thermal and combustion performance of a combustor with microchannel cooling;Deng;Energy,2019

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