High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift-Reference-Cited by-同舟云学术

High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift

Published:2013-09-23 Issue:11 Volume:135 Page:
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Herwig Heinz¹

Affiliation:

1. Institute of Thermo-Fluid Dynamics, Hamburg University of Technology, Denickestraße 17, 21073 Hamburg, Germany e-mail:

Abstract

In a discussion initiated by the German Research Foundation (DFG) about cooling of electronics, two aspects turned out to be important: The need for a paradigm shift from an “add on” to an “integrated multidisciplinary” solution and the definition of generic demonstrators for cooling strategies.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4024621/6206259/ht_135_11_111013.pdf

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