Challenges in Cooling Design of CPU Packages for High-Performance Servers
Author:
Affiliation:
1. a Corporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/01457630701686727
Reference46 articles.
1. Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions
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