Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
Author:
Amon Cristina H.1, Yao S.-C.1, Wu C.-F.1, Hsieh C.-C.1
Affiliation:
1. Mechanical Engineering Department, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213
Abstract
This paper describes the development of embedded droplet impingement for integrated cooling of electronics (EDIFICE), which seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100W/cm2, employing latent heat of vaporization of dielectric fluids. Micromanufacturing and microelectromechanical systems are used as enabling technologies for developing innovative cooling schemes. Microspray nozzles are fabricated to produce 50–100 μm droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and effective evaporation. This paper examines jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, microspray characteristics, and surface evaporation. The development of micronozzles and microstructured surface texturing is discussed. Results of a prototype testing of swiss-roll swirl nozzles with dielectric fluid HFE-7200 on a notebook PC are presented. This paper also outlines the challenges to practical implementation and future research needs.
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference65 articles.
1. Park, K. A., and Bergles, A. E., 1986, “Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks,” Proc. 8th International Heat Transfer Conference, Hemisphere Publishing Co., Washington, DC, 4, pp. 2099–2104. 2. Park, K. A., and Bergles, A. E., 1988, “Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux,” J. Heat Transfer, 10, pp. 728–734. 3. Bergles, A. E., and Kim, C. J., 1988, “A Method to Reduce Temperature Overshoots in Immersion Cooling of Electronic Devices,” Proc. InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components, IEEE, New York, NY, pp. 100–105. 4. Carvalho, R. D. M., and Bergles, A. E., 1990, “The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips,” Proc. 9th International Heat Transfer Conference, Hemisphere Publishing Co., New York, NY, pp. 289–294. 5. Park, K. A., Bergles, A. E., and Danielson, R. D., 1990, “Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Fluorinert Liquids,” Heat Transfer in Electronic and Microelectronic Equipment, Bergles, A. E. ed., Hemisphere Publishing Co., New York, NY, pp. 573–588.
Cited by
42 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|