The Investigation of the Silicon Fabricated Balanced Shunt Micro Pin Fins Cold Plate for High Heat Flux Devices

Author:

Ren Qingbao,Yu Huiyu,Liu Yuanyang,Wang Zhenyu

Publisher

IEEE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Experimental indirect cooling performance analysis of the metal 3D-printed cold plates with two different supporting elements;International Communications in Heat and Mass Transfer;2023-11

2. Experimental Study on Indirect Liquid Cooling Performance of Metal 3D-Printed Cold Plates for Battery Thermal Management;Heat Transfer Engineering;2023-10-04

3. Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

4. Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles;Energy Conversion and Management;2023-01

5. The 3D Tesla Valve Manifold Two-Phase Cold Plate for the SiC Power Device Module;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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