Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink-Reference-Cited by-同舟云学术

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

Published:2024-03 Issue:3 Volume:14 Page:397-405
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Feng Huicheng¹^ORCID,Tang Gongyue¹^ORCID,Zhang Xiaowu¹^ORCID,Lau Boon Long¹,Jong Ming Chinq¹,Au Keng Yuen Jason¹,Ong Jun Wei Javier¹,Chui King Jien¹,Li Jun²^ORCID,Li Hongying²,Vinh Le Duc²^ORCID,Lou Jing²^ORCID

Affiliation:

1. Institute of Microelectronics (IME), Agency for Science, Technology and Research (A*STAR), Fusionopolis, Singapore

2. Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), Fusionopolis, Singapore

Funder

Agency for Science, Technology and Research, Singapore

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10500445/10453269.pdf?arnumber=10453269

Reference42 articles.

1. Moore’s Law for Packaging to Replace Moore’s Law for ICS

2. Recent Advances and Trends in Advanced Packaging

3. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)

4. Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling

5. A Dynamic Control System for Server Processor Direct Liquid Cooling

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