Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions
Author:
Affiliation:
1. Department of Industrial and Systems Engineering, Auburn University, Auburn, AL, USA
Funder
Graduated NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) at Auburn University
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
https://ieeexplore.ieee.org/ielam/5503870/10082754/10027855-aam.pdf
Reference27 articles.
1. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders
2. Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
3. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly
4. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
5. Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition
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