Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

Author:

Nathan Ip1,Nejadsadeghi Nima1,Kohama Norifumi2,Tanoue Hayato2,Motoda Kimio2

Affiliation:

1. Tokyo Electron America, Inc,Austin,Texas,United States

2. Tokyo Electron Kyushu Limited,Koshi,Kumamoto,Japan

Publisher

IEEE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Elucidating the mechanism of four corner voids in chip-on-wafer hybrid bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

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