Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations-Reference-Cited by-同舟云学术

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Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations

Published:2023-04-27 Issue: Volume: Page:
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Container-title:Metrology, Inspection, and Process Control XXXVII
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Author:

van Haren Richard J. F.,Li Suwen,Minghetti Blandine,van Dijk Leon,Brantjes Klaas,Fournel Frank,Mauguen Gaelle,Mendes Ivanie,Lapeyre Celine,Pourteau Marie-Line,May Michael,Pain Laurent,Abadie Karine,Plach Thomas,Wimplinger Markus

Publisher

SPIE

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Driving exposure accuracy and cost-of-ownership on DUV immersion and dry-NXT scanner products;Optical and EUV Nanolithography XXXVII;2024-04-10

3. Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding;Novel Patterning Technologies 2024;2024-04-09

4. Present, Past, and Future of 3D Integration;Journal of The Japan Institute of Electronics Packaging;2024-03-01

5. Distortion Simulation for Direct Wafer-to-Wafer Bonding Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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