Author:
van Haren Richard J. F.,Li Suwen,Minghetti Blandine,van Dijk Leon,Brantjes Klaas,Fournel Frank,Mauguen Gaelle,Mendes Ivanie,Lapeyre Celine,Pourteau Marie-Line,May Michael,Pain Laurent,Abadie Karine,Plach Thomas,Wimplinger Markus
Cited by
1 articles.
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1. Distortion Simulation for Direct Wafer-to-Wafer Bonding Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05