1. The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding
2. Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits;orkut okudur;Wafer Bonding Conference,2017
3. Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
4. Optimization of Cu/SiCN CMP process for surface preparation targeting W2W hybrid bonding;dewilde;Wafer Bond,2022
5. 3D SoC integration, beyond 2.5D chiplets