1. Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC;imed;2017 15th IEEE International New Circuits and Systems Conference (NEWCAS),2017
2. A study on bonding pad structure and layout for Fine pitch hybrid bonding;juhyeon;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),2022
3. Process and Design Optimization for Hybrid Cu Bonding Void;hyoeun;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),2022
4. Die to wafer direct hybid bonding demonstration with high alignment accuracy and electrical yields;amadine;2019 International 3D Systems Integration Conference (3DIC),2019
5. Characterization of fine pitch hybrid bonding pads using electrical misalignment test vehicle;imed;2019 IEEE 69th Electronic Components and Technology Conference (ECTC),2019