Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
Author:
Affiliation:
1. Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA
2. Pennsylvania State University,3D Systems Packaging Research Center,Dept. of Electrical Engineering
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195375.pdf?arnumber=10195375
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4. Organic interposer and embedded substrate;yamada;2015 Packaging Symposium Kyocera America Inc,2015
5. Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
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