Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps-Reference-Cited by-同舟云学术

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Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Oi Kiyoshi,Otake Satoshi,Shimizu Noriyoshi,Watanabe Shoji,Kunimoto Yuji,Kurihara Takashi,Koyama Toshinori,Tanaka Masato,Aryasomayajula Lavanya,Kutlu Zafer

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897310.pdf?arnumber=6897310

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