A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration
Author:
Affiliation:
1. University of California, Los Angeles,Los Angeles,USA,90095
Funder
Semiconductor Research Corporation (SRC) JUMP ASCENT, UCOP
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195559.pdf?arnumber=10195559
Reference14 articles.
1. Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric
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3. Functional Demonstration of < 0.4-pJ/bit, 9.8 μm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging using Silicon Interconnect Fabric
4. A 16-nm 784-Core Digital Signal Processor Array, Assembled as a 2 × 2 Dielet With 10-μm Pitch Interdielet I/O for Runtime Multiprogram Reconfiguration
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