Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets
Author:
Affiliation:
1. UCLA Center for Heterogeneous Integration and Performance Scaling,Los Angeles,US
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565098.pdf?arnumber=10565098
Reference21 articles.
1. Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems
2. Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding
3. Copper to gold thermal compression bonding in heterogenous wafer-scale systems
4. Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration
5. Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems
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