1. Waferscale Network Switches;2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA);2024-06-29
2. Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms;Proceedings of the Great Lakes Symposium on VLSI 2024;2024-06-12
3. An active, high bandwidth, flexible connector for large area computational systems;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Hybrid Interconnect Infrastructure for Inter-Chiplet Communication in Wafer-Scale Systems;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28