Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics
Author:
Affiliation:
1. Samsung Electronics,Mechatronics Research,Hwaseong-si,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195561.pdf?arnumber=10195561
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