Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics
Author:
Affiliation:
1. Samsung Electronics,Mechatronics Research,Hwaseong-si,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195561.pdf?arnumber=10195561
Reference13 articles.
1. Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics
2. Effect of interfacial SiO2 thickness for low temperature O2 plasma activated wafer bonding
3. Bonding of silicon wafers for silicon‐on‐insulator
4. Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process
5. Overview and outlook of through‐silicon via (TSV) and 3D integrations
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding;Journal of Electroanalytical Chemistry;2024-09
2. Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via Non-selective Chemical Mechanical Polishing and Post-cleaning Steps;ECS Journal of Solid State Science and Technology;2024-07-01
3. Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm;Journal of Electronic Materials;2024-06-06
4. Exploring Bonding Mechanism of SiCN for Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Towards Standardization of Hybrid Bonding Interface: In-depth Study of Dielectrics on Direct Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3