Double Side SiP of Structure Strength Analysis for 5G and Wearable Application-Reference-Cited by-同舟云学术

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Double Side SiP of Structure Strength Analysis for 5G and Wearable Application

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Tsai Mike¹,Li Wynn¹,Ding Ethan¹,Chang Tim¹,Chang Kevin¹,Chang Karina¹,He Eric¹,Chen J. Y.¹,Hsieh Rios¹,Chiu Ryan¹,Lin James¹

Affiliation:

1. SPIL,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816497.pdf?arnumber=9816497

Reference5 articles.

1. Mechanical Reliability Analysis of Dual Side Molding SiP Module

2. Heterogeneous Integration of Double Side SiP for IoT and 5G Application

3. Highly Integrated Assembly Processes Solutions for Double-Sided-SiP Package

4. Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

5. Characterization of Dual Side Molding SiP Module

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultra-thin Double Side SiP Technology with Embedded Trace Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Risk Reduction Strategies for SiP Design and Manufacturing;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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