Author:
Ma Bo-Hao,Ho David,Wang Yu-Po,Yen Freedman,Guo Shawn,Chiu Ryan
Cited by
4 articles.
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1. Ultra-thin Double Side SiP Technology with Embedded Trace Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Risk Reduction Strategies for SiP Design and Manufacturing;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Double Side SiP of Structure Strength Analysis for 5G and Wearable Application;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05